In a nutshell: Western Digital plans to begin mass-producing 162-layer BiCS6 3D NAND, which is probably going for use in PCIe 5 SSDs by the tip of this yr. The corporate can be engaged on NAND with 200+ layers meant for datacenter storage, PLC, and methods to bond collectively a number of 3D NAND wafers to extend the variety of layers.
Western Digital, along with associate Kioxia, simply gave us a have a look at their roadmap for the following few years of NAND improvement. The corporate plans to introduce its sixth technology BiCS quickly, which is able to characteristic 162 layers in TLC and QLC configurations.
Whereas that may not sound so spectacular contemplating rivals like Micron have had 176-layer NAND for some time now, WD claims they may shrink the reminiscence cell measurement by utilizing a brand new materials, leading to smaller die sizes.
The corporate hopes that this can enable them to construct cheaper storage gadgets that carry out simply as nicely. Mass manufacturing of BiCS6 3D NAND is scheduled to begin in late 2022, with WD planning to make use of these chips in merchandise starting from low-cost USB drives to PCIe 5.0 SSDs.
WD additionally talked about their upcoming BiCS+ reminiscence with over 200 layers, which is about to reach by 2024. It should characteristic 55 p.c extra bits per wafer, 60 p.c larger switch velocity, and a 15 p.c larger write velocity in comparison with BiCS6.
It is price noting that BiCS+ is supposed for use solely in datacenter SSDs, as the corporate plans to supply a unique class of 2xx-layer NAND for client storage, dubbed BiCS-Y.
Western Digital moreover shared that they’re engaged on a number of applied sciences to enhance density and capability, together with PLC, and that they are planning to construct NAND with 500+ layers throughout the subsequent decade.
